The MODFLOW and More 2024 conference, themed "AI, Global Change, and the Future of Groundwater Modeling," will take place from June 2-5, 2024, at Princeton University. This conference, [...]
The Automotive CAE Grand Challenge 2024 provides a platform for companies in the automotive engineering and simulation domain to showcase their latest technologies, solutions, and inno [...]
Photo: Fraunhofer IML, Frederic Eynck scapos draws an extremely successful balance from the LogiMAT trade fair 2024 in Stuttgart! It was our first LogiMAT as an exhibitor. The tra [...]
Photo: Sandra Ritschel On October 18th and 19th, the FF4EuroHPC and EuroCC 2 consortia brought together eminent representatives from industry and politics, representatives from the Nat [...]
As expected, this year's LS-DYNA conference in Baden-Baden was again an important industry meeting for users of the LS-DYNA product family. In addition to the approximately 200 technic [...]
As a partner of the Fraunhofer Gesellschaft, we were represented at the Fraunhofer joint booth at the leading international trade fair for logistics, mobility, IT and supply chain mana [...]
Automotive CAE Grand Challenge 2023 - scapos presents CAE software products. Dr. Guy Lonsdale presented software solutions for analyzing and performing complex multiphysics simulations [...]
Kansai Logistics Show, Osaka / Korea MAT, Seoul - our distribution partners present software products for packaging optimization. In order to be able to offer the software products in [...]
