SC24, the International Conference for High-Performance Computing, Networking, Storage, and Analysis, was held in Atlanta from November 17-22, 2024, at the Georgia World Congress Cente [...]
At FachPack 2024, we presented ourselves with a creative exhibition stand under the motto "RELAX - and let our software do the work!". Under palm trees and in a relaxed atmosphere, vis [...]
The Automotive CAE Grand Challenge 2024 provides a platform for companies in the automotive engineering and simulation domain to showcase their latest technologies, solutions, and inno [...]
Photo: Fraunhofer IML, Frederic Eynck scapos draws an extremely successful balance from the LogiMAT trade fair 2024 in Stuttgart! It was our first LogiMAT as an exhibitor. The tra [...]
Photo: Sandra Ritschel On October 18th and 19th, the FF4EuroHPC and EuroCC 2 consortia brought together eminent representatives from industry and politics, representatives from the Nat [...]
As expected, this year's LS-DYNA conference in Baden-Baden was again an important industry meeting for users of the LS-DYNA product family. In addition to the approximately 200 technic [...]
As a partner of the Fraunhofer Gesellschaft, we were represented at the Fraunhofer joint booth at the leading international trade fair for logistics, mobility, IT and supply chain mana [...]
Automotive CAE Grand Challenge 2023 - scapos presents CAE software products. Dr. Guy Lonsdale presented software solutions for analyzing and performing complex multiphysics simulations [...]
Kansai Logistics Show, Osaka / Korea MAT, Seoul - our distribution partners present software products for packaging optimization. In order to be able to offer the software products in [...]
