Review: Automotive CAE Grand Challenge 2024
The Automotive CAE Grand Challenge 2024 provides a platform for companies in the automotive engineering and simulation domain to showcase their latest technologies, solutions, and innovations. This year scapos will be highlighting: the MpCCI suite (co-simulation [...]
Review: LogiMAT 2024 offered us an excellent platform
Photo: Fraunhofer IML, Frederic Eynck scapos draws an extremely successful balance from the LogiMAT trade fair 2024 in Stuttgart! It was our first LogiMAT as an exhibitor. The trade fair provided an excellent platform to present our innovative software solut [...]
New AI Products in the healthcare area
In general, the availability of advanced AI tools promises enormous innovation in healthcare, from the development of new pharmaceutical solutions to patient-specific care. From aiding physicians with data analysis to empowering patients with virtual assistants, [...]
scapos AG and SOLIZE India announce strategic partnership
SOLIZE India will be our exclusive partner for marketing, sales, technical support and service solutions for the PackAssistant software in India SOLIZE India brings its deep understanding of the Indian engineering industry to the collaboration and has a track rec [...]
scapos at the NAFEMS DACH Conference 2024
Let's meet at the seventh NAFEMS DACH Conference from June 10 - 12, 2024 in Bamberg, Germany! scapos is an exhibitor at the NAFEMS DACH conference and presents software solutions for the analysis and execution of complex multiphysics simulations of the Fraunhofer [...]
scapos at the LogiMAT 2024
Get to know PackAssistant and PUZZLE! Today more than ever, intralogistics is faced with the challenge of responding to fundamental market needs: scarce resources in terms of materials and skilled workers, increasingly strained and agile supply chains, the need f [...]
scapos at the Automotive CAE Grand Challenge 2024
Get to know the Fraunhofer CAE product portfolio! At this year's automotive CAE Grand Challenge (April 16-17, 2024, Frankfurt/Hanau) scapos will present the software solutions for the analysis and execution of complex multiphysics simulations of the Fraunhofer In [...]
New sales activities
We are intensifying our activities in the field of cutting and packaging optimisation and welcome Mario Prang as sales manager for the products AutoBarsizer, AutoPanelsizer and CuboNester. With many years of experience in technical sales and in-depth expertise, M [...]
Peaceful Christmas!
War, violence and expulsion are unfortunately an omnipresent reality for millions of families and children, and fleeing is the only way out of their plight. Children in particular suffer, it is not enough for them simply to survive, a better future is their right [...]
scapos present at the 2023 Supercomputing Conference in Denver
The “SC23” conference and exhibition held in Denver, Colorado (November 13th-16th) provided a great opportunity to network with many of our colleagues and collaboration partners from the European HPC ecosystem (including R&D projects and ETP4HPC). Results fro [...]
Release: PackAssistant 5.0.1
With version 5.0.1, the Fraunhofer Institute SCAI has published a new release for the leading 3D packaging software PackAssistant . This version offers a greatly revised project page, which now makes it possible to allow any rotations and thus achieve even better [...]
Review: HPC Industry Summit and Closure of FF4EuroHPC Project
Photo: Sandra Ritschel On October 18th and 19th, the FF4EuroHPC and EuroCC 2 consortia brought together eminent representatives from industry and politics, representatives from the National Competence Centres, HPC experts and enthusiasts at the HPC Industry Summi [...]
Review: LS-DYNA Conference 2023
As expected, this year's LS-DYNA conference in Baden-Baden was again an important industry meeting for users of the LS-DYNA product family. In addition to the approximately 200 technical presentations, participants had the opportunity to find out about the latest [...]
MpCCI – Multiphysics applications for the automotive industry!
The MpCCI portfolio from Fraunhofer Institute SCAI includes a range of multiphysics interface solutions for co-simulation, integrated CAE workflows, digital twins and accompanying CAE service solutions. The MpCCI interface software is a vendor-neutral solution fo [...]
scapos at the HPC Industry Summit in Berlin!
scapos as one of the FF4EuroHPC Consortium partners is happy to share the invitation to the HPC Industry Summit which will take place at GLS Campus Berlin, Germany, from 18-19th October. In today's rapidly evolving industrial landscape, the adoption of High-Perfo [...]
Fraunhofer CAE Solutions at the 14th European LS-DYNA Conference in Baden-Baden!
Get to know Fraunhofer CAE solutions at the 14th European LS-DYNA Conference in Baden-Baden! At this year's LS-Dyna conference (October 18-19, 2023, Baden-Baden), scapos will present the latest CAE developments from the Fraunhofer Institute SCAI and Fraunhofer In [...]
Review: transport logistic in Munich 2023
As a partner of the Fraunhofer Gesellschaft, we were represented at the Fraunhofer joint booth at the leading international trade fair for logistics, mobility, IT and supply chain management, "transport logistic", from May 9 to 12, 2023. In total, Fraunhofer IML, [...]
Review: Automotive CAE Grand Challenge 2023
Automotive CAE Grand Challenge 2023 - scapos presents CAE software products. Dr. Guy Lonsdale presented software solutions for analyzing and performing complex multiphysics simulations at the Automotive CAE Grand Challenge 2023. Featured software solutions [...]
Review: Kansai Logistics Show, Osaka / Korea MAT, Seoul
Kansai Logistics Show, Osaka / Korea MAT, Seoul - our distribution partners present software products for packaging optimization. In order to be able to offer the software products in all relevant markets, scapos AG can rely on sales partnerships with selected so [...]
Meet us at transport logistic in Munich 2023
Packing software PackAssistant and PUZZLE® at transport logistic 2023! scapos AG will again be an exhibitor at this year's transport logistic in Munich (May 9 - 12, 2023) and will present the following products for packaging optimization at the Fraunhofer booth i [...]